3M AF42

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

3M AF42

Main features

  • Clear Structural Bondline
  • Clean Non Tack Layup
  • High Peel Toughened Film

Product Description

3M Thermal Bonding Film AF42 is a translucent, non-tacky epoxy thermoset film for structural attachment of metal, glass, and engineering-grade substrates in electronics assemblies. The 3 mil adhesive layer is supplied on a 6.5 mil brown paper liner for clean cutting and placement. Low flow supports bondline control during heat cure, and the adhesive cures clear. A 60 minute cure at 177 deg C develops the final bond, while alternate higher-temperature cycles support shorter processing times.

Key features

  • Clear Cured Bondline: The translucent film cures to a clear structural adhesive layer.
  • Non Tack Low Flow Handling: The preformed film supports clean placement and controlled flow during cure.
  • Heat Cured Structural Bonding: The epoxy film bonds compatible metals, glass, and engineering substrates.

Applications

Electronics assembly bonding, metal and glass attachment, and structural film bonding with a compatible heat-cure process.

Product Family

3M AF42

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Technical Specifications

No specifications available.

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Base resinEpoxy-As supplied
Adhesive thickness3milNominal
Liner thickness6.5milBrown paper liner
TackNone-At room temperature
ColorTranslucent-Before cure
Room-temperature work life4weeksAt 21 deg C
Shelf life15monthsStored at 4 deg C
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
ColorClear-After cure
Tensile strength4800psiCured film
Elongation250%Cured film
Modulus65000psiCured film
Overlap shear on etched aluminum4600psiASTM D1002; 3 mil bondline
Overlap shear on FR-42500psiASTM D1002; solvent-wiped substrate

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