3M DP460EG
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- Long Work Life Assembly
- Low Outgassing Electronics Bonding
- Toughened Structural Epoxy
Product Description
3M Scotch-Weld Epoxy Adhesive DP460EG is a toughened, two-part electronics-grade epoxy with a 2:1 mix ratio and a 110 minute work life. The long processing window supports precise bonding, fixing, rigidizing, potting, and magnet assembly before handling strength develops in approximately four hours. DP460EG combines strong structural bonding with controlled total and siloxane outgassing for sensitive assemblies. Room-temperature cure is available, while elevated-temperature schedules accelerate cure and can increase glass-transition performance in controlled production environments.
Key features
- Long Work Life Assembly: The 110 minute work life supports precise placement and multi-step assembly.
- Low Outgassing Electronics Bonding: Controlled total and siloxane outgassing supports sensitive electronic components.
- Toughened Structural Epoxy: The cured adhesive provides high overlap shear and peel performance on prepared aluminum.
Applications
Hard disk drive assembly, bearing and spindle components, magnet bonding, fixing, rigidizing, and potting.
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by volume | 2:1 | B:A | Two-part system |
| Mix ratio by weight | 2.0:0.96 | B:A | Two-part system |
| Base color | White | - | Before mixing |
| Accelerator color | Amber | - | Before mixing |
| Base viscosity | 25 to 45 | Pa.s | At 23 deg C |
| Accelerator viscosity | 8 to 14 | Pa.s | At 23 deg C |
| Mixed viscosity | 15 to 25 | Pa.s | At 23 deg C |
| Work life | 110 | min | At 23 deg C |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Total outgassing | Less than 1000 | ug/g | GC/MS; 85 deg C for 3 h; ASTM 5116 basis |
| Siloxane outgassing | 5 maximum | ug/g | GC/MS; 85 deg C for 3 h; ASTM 5116 basis |
| Thermal conductivity | 0.263 | W/mK | At 45 deg C |
| Dielectric constant | 4.6 | - | 1 kHz at 23 deg C |
| Dielectric strength | 35.8 | V/mil | 31 mil specimen |
| Overlap shear strength | Greater than 35.5 | MPa | Etched aluminum; 24 h cure at 23 deg C |
| T-peel strength | 10.55 | N/mm | Anodized aluminum; 24 h cure at 23 deg C |
