ABLESTIK 5074
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Flexible Dissimilar-Material Bonding
- Multiple Heat-Cure Options
- Reworkable Non-Conductive Film
Product Description
LOCTITE ABLESTIK 5074 is a configurable, non-conductive epoxy adhesive film reinforced with glass fabric for electronics assembly. The flexible, reworkable film is used across mixed-material interfaces, with thickness and dimensions selected for the supplied configuration. It has a 24-hour work life at 25 deg C and can be heat cured for 180 minutes at 100 deg C, 90 minutes at 125 deg C, or 60 minutes at 150 deg C. The cured material has a typical thermal conductivity of 0.9 W/(m K). It is supplied as sheet stock or die-cut preforms.
Key features
- Flexible mixed-material film: Bonds dissimilar materials with differing coefficients of thermal expansion in electronics assemblies.
- Multiple heat-cure options: Three supported time-and-temperature schedules provide practical cure flexibility for the assembly process.
- Reworkable non-conductive construction: Provides a non-conductive film bond in a format intended for assemblies that may require rework.
Applications
Applications include electronics assembly bonding of dissimilar materials with differing coefficients of thermal expansion.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Supplied thickness and dimensions depend on the selected sheet or die-cut configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | White | As supplied | |
| Film construction | Epoxy-coated glass fabric | Configurable 5074 family | |
| Work life | 24 | hours | 25 deg C |
| Shelf life | 183 | days | -40 deg C; from date of manufacture |
| Available forms | Sheet stock or die-cut preforms | Thickness and dimensions are configuration-specific | |
| Cure schedule | 180 at 100; 90 at 125; 60 at 150 | minutes at deg C | Guideline heat-cure options |
After-processing / final-state properties
Final-state values are typical for the cured 5074 family material and the stated test configurations.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion, below Tg | 45 | ppm/deg C | Typical |
| Coefficient of thermal expansion, above Tg | 350 | ppm/deg C | Typical |
| Glass transition temperature | 3 | deg C | Typical |
| Thermal conductivity | 0.9 | W/(m K) | Laser flash |
| Lap shear strength | 8 | N/mm^2 | Aluminum-to-aluminum; 25 deg C |
| Lap shear strength | 5 | N/mm^2 | Gold-to-gold; 25 deg C |
