ARATHANE 7760-1
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Automated Non-Slump Dispensing
- 630 V/mil Dielectric Strength
- 0.8 W/m-K Thermal Conductivity
Product Description
ARATHANE 7760-1 Thermal Transfer Adhesive is an off-white, one-component, solvent-free paste for bonding, filleting, and protecting components on printed wiring boards. Its thixotropic, non-slump rheology supports accurate automatic dispensing and helps the material remain in place before cure. The cured adhesive combines 0.8 W/m-K thermal conductivity with 630 V/mil dielectric strength, providing thermal transfer and electrical insulation within the tested material configuration. A three-month frozen shelf life and short room-temperature thaw time support production handling. The adhesive is suited to PCB and wire-bonding applications that require repeatable placement, thermal performance, and substrate-specific bond strength.
Key Features
- Automated non-slump dispensing: Thixotropic rheology supports repeatable placement before cure.
- Thermal and dielectric performance: Provides 0.8 W/m-K conductivity and 630 V/mil dielectric strength after cure.
- Frozen one-part storage: A three-month shelf life below -40 deg C supports production inventory control.
Applications
Bonding, filleting, and protection of components on printed wiring boards, including wire-bonding uses.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
One-component adhesive values; methods and storage conditions are shown with each property.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Off-white paste | - | Visual |
| Formulation | One-component, 100% solids, solvent-free | - | As supplied |
| Density | 1.9 to 2.4 | g/cm3 | ASTM D792 |
| Viscosity | 240,000 to 740,000 | cP | ASTM D2393 at 25 deg C |
| Flash point | 93 minimum | deg C | ASTM D93 |
| Shelf life | 3 | months | Sealed original container below -40 deg C |
After-processing / final-state properties
Cured-material values; lap-shear results apply only to the listed substrate and ASTM D1002 configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 65 to 90 | Shore A | Cured material |
| Glass-transition temperature | -63 | deg C | ISO 11359 |
| Thermal conductivity | 0.8 | W/m-K | ISO 8894:1990 |
| Dielectric strength | 630 | V/mil | IEC 60243 |
| Lap-shear strength | 200 | psi | ASTM D1002 at 25 deg C; etched aluminum |
| Lap-shear strength | 130 | psi | ASTM D1002 at 25 deg C; Freon-degreased nickel plate |
| Lap-shear strength | 230 | psi | ASTM D1002 at 25 deg C; Freon-degreased polyimide |
| Lap-shear strength | 220 | psi | ASTM D1002 at 25 deg C; Freon-degreased solder plate |
