DOWSIL 3-4088

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

DOWSIL 3-4088

Main features

  • 4.5-Minute Working Time
  • Low-Viscosity Under-Component Flow
  • Soft Dielectric Gel Protection

Product Description

DOWSIL 3-4088 Dielectric Gel uses a two-part, 1:1 mix silicone gel to seal and protect devices with delicate electronic components. Matched low component viscosities support flow beneath and around components, while a 4.5-minute working time and 11-minute gel time provide a fast room-temperature process without an oven. The cured gel remains extremely soft and combines a gel hardness of 55 with dielectric strength, dielectric constant and volume-resistivity data for electrical encapsulation evaluation. Manual or automated meter-mix dispensing can be used, with accurate proportioning, complete mixing and air-control practices selected for the assembly geometry.

Key features

  • Fast room-temperature gelation: Typical working time is 4.5 minutes with an 11-minute gel time.
  • Low-viscosity component flow: Part A and Part B viscosities are 775 and 700 cP.
  • Soft electrical encapsulation: Cured gel hardness is 55 with 500 V/mil dielectric strength.

Applications

Sealing and protecting devices and assemblies with delicate electronic components.

Product Family

DOWSIL 3-4088

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component SystemComponent System
Two (A / B)
Mix RatioMix Ratio
1:1
Pot LifePot Life
4.5 minutes
Specific GravitySpecific Gravity
0.97 / 0.96
Electrical Properties
Dielectric StrengthDielectric Strength
19.5 kV/mm
Volume ResistivityVolume Resistivity
2.0 x 10¹³ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical component and mixed-material values. Values are not specifications.

Property Value Unit Method / condition
Mix ratio 1:1 By weight, Part A to Part B
Part A viscosity 775 cP As supplied
Part B viscosity 700 cP As supplied
Mixed viscosity 875 cP After 1:1 mixing
Working time 4.5 min At 25 deg C; pot life
Specific gravity, Part A 0.97 Uncured
Specific gravity, Part B 0.96 Uncured
Gel time 11 min Typical value
Technical properties

After-processing / final-state properties

Typical cured-gel electrical and softness properties. Values are not specifications.

Property Value Unit Method / condition
Gel hardness 55 Typical cured value
Dielectric strength 500 (19.5) V/mil (kV/mm) Typical cured value
Dielectric constant 2.5 At 100 Hz
Dielectric constant 2.8 At 100 kHz
Volume resistivity 2.0 x 10^13 ohm cm Typical cured value
Dissipation factor 0.0025 / 0.0022 At 100 Hz / 100 kHz

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