DOWSIL DA-6534
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- 6.8 W/(m K) Thermal Conductivity
- 1.8E-04 ohm-cm Volume Resistivity
- One-Part Silver-Filled Silicone
Product Description
DOWSIL DA-6534 Adhesive is a one-part, gray, silver-filled silicone adhesive for conductive thermal-interface and lid-seal work in microelectronics. A cone-and-plate viscosity of 103,000 cP and thixotropy of 2 define the as-supplied dispensing profile, while the material heat-cures for 120 minutes at 150 deg C. The cured adhesive combines 6.8 W/(m K) thermal conductivity, 1.8E-04 ohm cm volume resistivity and 0.12 deg C cm^2/W thermal resistance at 40 psi. Unprimed aluminum lap-shear data and adhesion to nickel, aluminum, laminate and silicon support substrate-specific evaluation.
Key features
- Silver-filled conductive adhesive: Combines thermal and electrical conduction in a one-part silicone formulation.
- 6.8 W/(m K) thermal conductivity: Supports evaluation for microelectronics thermal-interface and lid-seal applications.
- Low bulk resistivity: Typical cured volume resistivity is 1.8E-04 ohm cm.
Applications
TIM1 thermal-interface and lid-seal applications in microelectronics, with adhesion evaluation on nickel, aluminum, laminate and silicon.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied and heat-cure process values. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component count | One | As supplied | |
| Color | Gray | As supplied | |
| Viscosity | 103000 | cP | Cone and plate, Carrimed |
| Thixotropy | 2 | As supplied | |
| Heat-cure schedule | 120 | minutes | At 150 deg C |
After-processing / final-state properties
Typical cured properties. Thermal resistance is pressure-dependent, and adhesion is substrate-specific. Values are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 4.4 | Cured | |
| Durometer hardness | 91 | Shore A | JIS |
| Thermal conductivity | 6.8 | W/(m K) | Cured material |
| Thermal resistance | 0.12 | deg C*cm^2/W | At 40 psi |
| Unprimed lap shear to aluminum | 1.3 | MPa | Substrate-specific result |
| Volume resistivity | 1.8E-04 | ohm cm | Cured material |
| Sodium ion impurity | 0.1 | ppm | Na+ |
| Potassium ion impurity | 0.2 | ppm | K+ |
| Chloride ion impurity | 0.5 | ppm | Cl- |
| Glass transition temperature | -125 | deg C | DSC |
| Linear CTE | 125 | ppm/deg C | TMA |
