DOWSIL SE4400
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Extended 17-Hour Working Window
- Accelerated 30-Minute Heat Cure
- Thermally Conductive PCB Bonding
Product Description
DOWSIL SE 4400 Thermally Conductive Adhesive is a two-part gray silicone adhesive for thermal bonding in PCB system assembly modules. The flowable 1:1 mix has a typical mixed viscosity of 62,500 mPa s and a 17-hour working time at 25 deg C, providing an extended window for mixing, dispensing, and assembly. Heat cure is accelerated to 30 minutes at 150 deg C, and the addition-cure system produces no cure by-products, allowing deep-section and confined curing. The cured material has 0.92 W/(m K) thermal conductivity and 2.72 MPa unprimed lap shear strength on aluminum for combined heat transfer and attachment.
Key features
- Extended working window: A typical 17-hour working time at 25 deg C supports longer dispensing and assembly operations.
- Accelerated heat cure: Typical cure time is 30 minutes at 150 deg C.
- Thermal and bond performance: Cured bulk thermal conductivity is 0.92 W/(m K), with 2.72 MPa unprimed lap shear on aluminum.
Applications / Suitable for
- Thermal bonding in PCB system assembly modules
- Cooling assemblies that require combined attachment and heat transfer
Technical Specifications
General Properties
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical values for the mixed adhesive before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of parts | Two | Product configuration | |
| Mix ratio | 1:1 | Part A to Part B | |
| Color | Gray | As mixed | |
| Mixed viscosity | 62,500 | mPa s | Typical |
| Working time | 17 | hours | At 25 deg C |
| Heat cure time | 30 | min | At 150 deg C |
After-processing / final-state properties
Typical properties of the heat-cured adhesive.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Durometer hardness | 79 | Shore A | Cured |
| Specific gravity | 2.15 | Cured | |
| Tensile strength | 5.6 | MPa | Cured |
| Elongation | 85 | % | Cured |
| Unprimed lap shear | 2.72 | MPa | Aluminum |
| Dielectric strength | 25 | kV/mm | Cured |
| Thermal conductivity | 0.92 | W/(m K) | Cured bulk material |
