DOWSIL TC-4026

Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other

DOWSIL TC-4026

Main features

  • Printable Formed-In-Place Thermal Pads
  • Glass-Bead Thickness Control
  • Soft Reworkable Thermal Interface

Product Description

DOWSIL TC-4026 Dispensable Thermal Pad is a two-part, 1:1 mix silicone thermal interface material that can be screen printed, stencil printed, or automatically dispensed into controlled shapes. Glass beads help maintain the applied thickness through cure, supporting repeatable gap filling in compact PCB system assemblies. The mixed blue material has a typical viscosity of 70,000 mPa s and a four-hour pot life at 25 deg C. After cure, the soft Shore 00 50 elastomer provides 2.5 W/(m K) bulk thermal conductivity, 200% elongation, and dielectric insulation. Applications include cooling assemblies in LED lighting, automotive electronics, and consumer devices where a formed-in-place thermal pad is preferred.

Key features

  • Printable or dispensable format: Supports screen printing, stencil printing, and automated dispensing into application-specific shapes.
  • Controlled cured thickness: Glass beads help maintain the applied pad thickness through cure.
  • Soft thermal interface: The cured Shore 00 50 elastomer has 2.5 W/(m K) bulk thermal conductivity.

Applications / Suitable for

  • LED lamp and luminaire cooling assemblies
  • Automotive electronic assemblies
  • Consumer-device PCB cooling
Product Family

DOWSIL TC-4026

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Part A: White | Part B: Blue
Specific GravitySpecific Gravity
2.8
Physical Properties
Viscosity (Part A)Viscosity (Part A)
73000 mPa.s
Viscosity (Part B)Viscosity (Part B)
74000 mPa.s
Thermal Properties
Thermal ConductivityThermal Conductivity
2.5 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

Typical handling and cure data for the two-part material before and during processing.

Property Value Unit Method / condition
Number of parts 2 Part A and Part B
Mix ratio 1:1 Part A to Part B
Component colors White/off-white; blue Part A; Part B
Mixed color Blue After mixing
Mixed viscosity 70,000 mPa s Typical
Pot life 4 h At 25 deg C
Room-temperature cure 24 h At 25 deg C
Heat-cure schedule 15 min At 100 deg C
Technical properties

After-processing / final-state properties

Typical properties of the cured thermal pad material.

Property Value Unit Method / condition
Specific gravity 2.8 Cured material
Durometer hardness 50 Shore 00 Cured material
Thermal conductivity 2.5 W/(m K) Cured bulk material
Tensile strength 24 psi Cured material
Elongation 200 % Cured material
Dielectric strength 18 kV/mm Cured material
Volume resistivity 3.9 x 10^12 ohm cm Cured material

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