DOWSIL TC-6032
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

Main features
- Extended-Flow Electronic Encapsulation
- 3.2 W/(m K) Thermal Protection
- EV Power-Component Encapsulation
Product Description
DOWSIL TC-6032 Thermally Conductive Encapsulant is a two-part blue silicone encapsulant for thermal management and protection in electric-vehicle power electronics. The 1:1 system has a typical mixed viscosity of 6,500 mPa s and a 240-minute pot life at 25 deg C, providing extended flow and impregnation time before heat cure. Typical cure schedules include 60 minutes at 80 deg C, 30 minutes at 100 deg C, or 20 minutes at 120 deg C. The cured material combines 3.2 W/(m K) bulk thermal conductivity with Shore A 34 hardness, 45% elongation, and aluminum-to-aluminum lap shear strength of 0.38 MPa. It is used in on-board chargers, DC/DC converters, inductors, and transformers.
Key features
- Extended flow window: A 240-minute pot life at 25 deg C supports impregnation and complex dispensing.
- High thermal conductivity: The cured bulk material provides 3.2 W/(m K) thermal conductivity.
- Compliant cured material: Shore A 34 hardness and 45% elongation characterize the cured encapsulant.
Applications / Suitable for
- On-board chargers
- DC/DC converters
- Inductors and transformers
Technical Specifications
General Properties
Mechanical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical mixed-system properties and heat-cure windows before cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Number of parts | 2 | Part A and Part B | |
| Mix ratio | 1:1 | By weight | |
| Component colors | White; blue | Part A; Part B | |
| Mixed color | Blue | After mixing | |
| Mixed viscosity | 6,500 | mPa s | Typical |
| Pot life | 240 | min | At 25 deg C |
| Heat-cure schedule | 60 | min | At 80 deg C |
| Heat-cure schedule | 20 | min | At 120 deg C |
After-processing / final-state properties
Typical properties of the cured encapsulant; thermal conductivity is a bulk-material value.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Density | 2.73 | g/cm^3 | Cured material |
| Durometer hardness | 34 | Shore A | Cured material |
| Thermal conductivity | 3.2 | W/(m K) | Cured bulk material |
| Tensile strength | 0.5 | MPa | Cured material |
| Elongation | 45 | % | Cured material |
| Lap shear strength | 0.38 | MPa | Aluminum-to-aluminum |





















