DYMAX 6-621-GEL
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- Controlled Structural Gel Placement
- Mixed-Material Bonding Coverage
- Light, Heat, or Activator Cure
Product Description
Dymax Multi-Cure 6-621-GEL Adhesive is a gel-form structural adhesive for metals, glass, ceramic, polyamide, phenolic materials, and other supported substrates. The material cures with UV or visible light in exposed areas and can use secondary heat or a compatible activator where light access is limited. Its gel consistency supports localized placement and retention before cure, making the grade relevant to metal-to-glass bonding, coil winding, potting, and structural battery bonding. The product combines multi-route cure flexibility with a broader mixed-material substrate range for assemblies that include rigid inorganic surfaces and engineering polymers.
Key features
- Gel-form placement control: The gel consistency supports localized application and bead retention before cure.
- Mixed-material substrate reach: Supported materials include metals, glass, ceramic, polyamide, and phenolic substrates.
- Exposed and shadowed cure: Light, heat, and activator pathways support assemblies with varied cure access.
Applications / Suitable for
- Metal-to-glass bonding
- Coil winding and potting
- Structural battery bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Additional Information
As-supplied / before-processing properties
As-supplied and pre-cure characteristics for selecting and placing the gel adhesive.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Physical form | Gel adhesive | As supplied | |
| Primary cure activation | UV and visible light | Exposed adhesive areas | |
| Secondary cure option | Heat | Areas with limited light access | |
| Activator cure option | Compatible activator | Close-fitting or shadowed joints | |
| Supported substrate scope | Metal; glass; ceramic; polyamide; phenolic | Within the Bonding scope |
After-processing / final-state properties
Cured-joint characteristics and supported final assembly roles.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Final function | Structural bonded joint | After complete cure | |
| Joint placement character | Localized gel bondline | After cure of the placed gel | |
| Inorganic substrate scope | Metal; glass; ceramic | Bonded-material scope | |
| Polymer substrate scope | Polyamide; phenolic | Bonded-material scope | |
| Assembly applications | Coil winding; potting; structural battery bonding | Within the Application scope |
