EPO-TEK 377
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Low-Viscosity Optical Processing
- 24-Hour Mixed Pot Life
- High-Transmission Fiber-Optic Epoxy
Product Description
EPO-TEK 377 Epoxy is a two-component, high-Tg fiber-optic-grade epoxy for semiconductor and optical assembly. The pourable system mixes 1:1 by weight, has a typical viscosity of 150 to 300 cP at 23 deg C, and provides a 24-hour pot life. A recommended cure of one hour at 150 deg C develops electrical insulation and optical transmission, including at least 90% transmission from 600 to 1,000 nm. The material is used in fiber-optic, wafer-bonding, capillary-underfill, and other supported optical and semiconductor applications.
Key features
- Low-viscosity optical processing: Typical viscosity is 150 to 300 cP at 23 deg C and 100 rpm.
- Extended mixed-material window: The two-component system provides a 24-hour pot life.
- Optical and electrical performance: Typical cured data include at least 90% transmission from 600 to 1,000 nm and volume resistivity of at least 1 x 10^13 ohm cm.
Applications
- Fiber-optic assembly
- Semiconductor and optical packaging
- Wafer-to-wafer bonding
- Capillary underfill of flip-chip packages
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical values apply to the two-component material before cure and to the mixed system where stated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 1:1 | - | Part A:Part B |
| Specific gravity | Part A 1.15; Part B 1.22 | - | As supplied |
| Pot life | 24 | h | Mixed system |
| Shelf life - bulk | 1 | year | At room temperature |
| Shelf life - syringe | 6 | months | At -40 deg C |
| Color | Part A clear/colorless; Part B amber | - | Before cure |
| Consistency | Pourable liquid | - | Before cure |
| Viscosity | 150 to 300 | cP | At 23 deg C and 100 rpm |
After-processing / final-state properties
Typical cured values apply to the stated cure and test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Recommended cure | 1 | h | At 150 deg C |
| Glass transition temperature | >= 95 | deg C | Dynamic cure: 20 to 200 deg C; ISO 25 min; ramp -10 to 200 deg C at 20 deg C/min |
| Shore D hardness | 67 | - | Typical cured value |
| Lap shear strength | 1,456 | psi | At 23 deg C |
| Die shear strength | >= 10 kg / 3,556 | psi | At 23 deg C |
| Volume resistivity | >= 1 x 10^13 | ohm cm | At 23 deg C |
| Dielectric constant | 3.36 | - | At 1 kHz |
| Spectral transmission | >= 90 | % | At 600 to 1,000 nm and 23 deg C |
| Refractive index | 1.5195 | - | At 589 nm and 23 deg C |
