EPOTEK 301-2
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Low-Viscosity Capillary Processing
- Extended 8-Hour Pot Life
- Optical Encapsulation and Bonding
Product Description
EPO-TEK 301-2 Epoxy is a two-component, optically transparent epoxy for semiconductor, optical, and encapsulation applications. The clear, pourable system has a typical viscosity of 225 to 425 cP at 23 deg C, an 8-hour pot life, and a 100:35 mix ratio by weight. It cures in three hours at 80 deg C or two days at 23 deg C. Applications include flip-chip underfill, glob-top encapsulation, wafer-level spin coating, LED encapsulation, fiber-optic assembly, LCD lamination, and optical bonding.
Key features
- Low-viscosity processing: Typical viscosity is 225 to 425 cP at 23 deg C and 100 rpm.
- Extended pot life: The mixed system provides an 8-hour pot life.
- Optical transmission: Typical spectral transmission is greater than 99% from 400 to 1,200 nm after cure.
Applications
- Flip-chip underfill
- Glob-top encapsulation over wire bonds
- Wafer-level spin coating
- LED encapsulation
- Fiber-optic assembly
- LCD lamination and optical bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied values for the two-component clear epoxy system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 100:35 | - | Part A:Part B |
| Specific gravity | Part A 1.02; Part B 0.89 | - | As supplied |
| Pot life | 8 | h | Mixed system |
| Shelf life | 1 | year | At room temperature |
| Color | Part A clear/colorless; Part B clear/colorless | - | Before cure |
| Consistency | Pourable liquid | - | Before cure |
| Viscosity | 225 to 425 | cP | At 23 deg C and 100 rpm |
After-processing / final-state properties
Typical properties apply to material cured 3 hours at 80 deg C unless another condition is shown.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 3 h at 80 deg C; or 2 days at 23 deg C | - | Minimum bondline cure |
| Glass transition temperature | >= 80 | deg C | Dynamic cure 20 to 200 deg C; ISO 25 min; 20 deg C/min ramp |
| CTE | Below Tg 61; above Tg 180 | x 10^-6 in/(in deg C) | Cured 3 hours at 80 deg C |
| Hardness | 80 | Shore D | Cured 3 hours at 80 deg C |
| Lap shear strength | > 2,000 | psi | At 23 deg C |
| Die shear strength | >= 15 / 5,100 | kg / psi | At 23 deg C |
| Volume resistivity | >= 2 x 10^12 | ohm cm | Cured material |
| Spectral transmission | > 99 | % | 400 to 1,200 nm at 23 deg C |
