EPOTEK 360
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Capillary-Flow Underfill Processing
- Cure-Activated Color Inspection
- High-Temperature Optical Epoxy
Product Description
EPO-TEK 360 Epoxy is a two-component, low-viscosity heat-cure epoxy for semiconductor, electronics, and fiber-optic assembly. The pourable system mixes at 100:10 by weight, has a typical viscosity of 350 to 550 cP at 23 deg C, and provides a 6-hour pot life. A one-hour cure at 150 deg C develops the stated properties, while the material changes from clear to amber when properly cured for visual joint inspection. Applications include capillary-flow flip-chip underfill, fiber termination, copper-coil impregnation, SMD inductor coils, and ferrite-core bonding.
Key features
- Capillary-flow processing: Low viscosity supports wicking and capillary action for flip-chip underfill.
- Cure-activated color change: The material changes from clear to amber when properly cured for in-line joint inspection.
- High-temperature cured properties: The reported property set uses a one-hour cure at 150 deg C.
Applications
- Capillary-flow flip-chip underfill
- Fiber termination into ferrules
- Copper-coil impregnation
- SMD inductor coils
- Ferrite-core bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied and handling values for the two-component system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 100:10 | - | Part A:Part B |
| Specific gravity | Part A 1.15; Part B 1.02 | - | As supplied |
| Pot life | 6 | h | Mixed system |
| Shelf life | 1 | year | Bulk material at room temperature |
| Color | Part A clear/colorless; Part B amber | - | Before cure |
| Consistency | Pourable liquid | - | Before cure |
| Viscosity | 350 to 550 | cP | At 23 deg C and 100 rpm |
| Maximum total mixed mass | 25 | g | Do not exceed |
After-processing / final-state properties
Typical properties apply to material cured 1 hour at 150 deg C unless another condition is shown.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Recommended cure | 1 | h | At 150 deg C |
| Glass transition temperature | >= 90 | deg C | Dynamic cure 20 to 200 deg C; ISO 25 min; 20 deg C/min ramp |
| Hardness | 87 | Shore D | Cured 1 hour at 150 deg C |
| Lap shear strength | > 2,000 | psi | At 23 deg C |
| Die shear strength | >= 10 / 3,556 | kg / psi | At 23 deg C |
| Volume resistivity | >= 2 x 10^13 | ohm cm | At 23 deg C |
| Dielectric constant | 3.74 | - | At 1 kHz |
| Spectral transmission | > 97 | % | 700 to 1,600 nm at 23 deg C |
