EPOTEK H20E
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Electrically Conductive Die Attach
- 2.5-Day Mixed Pot Life
- Dispensable, Printable Silver Paste
Product Description
EPO-TEK H20E Silver-Filled Epoxy is a two-component, silver-filled electrically conductive epoxy for die attach and microelectronic interconnection. The smooth thixotropic paste mixes 1:1 by weight, has a 2.5-day pot life, and can be dispensed, stamped, or screen printed. A recommended cure of one hour at 150 deg C produces typical volume resistivity of no more than 0.0004 ohm cm and thermal conductivity of 2.5 W/(m K) by laser flash. Supported applications include attaching semiconductor die to lead frames, solderless flip-chip assembly, fine-pitch SMD printing, and hybrid microelectronics.
Key features
- Electrically conductive die attach: Typical cured volume resistivity is no more than 0.0004 ohm cm at 23 deg C.
- Long mixed-material window: The system provides a 2.5-day pot life.
- Flexible deposition methods: The thixotropic paste supports dispensing, stamping, and screen printing.
Applications
- Semiconductor die attach to lead frames
- Si and MEMS chip attachment
- Solderless flip-chip assembly
- Fine-pitch SMD printing
- Hybrid microelectronics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied values for the silver-filled two-component system and frozen syringe format where stated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 1:1 | - | Part A:Part B |
| Specific gravity | Part A 2.03; Part B 3.07; syringe 2.67 | - | As supplied |
| Pot life | 2.5 | days | Mixed system |
| Shelf life - bulk | 1 | year | At room temperature |
| Shelf life - syringe | 1 | year | At -40 deg C |
| Color | Part A silver; Part B silver | - | Before cure |
| Consistency | Smooth thixotropic paste | - | Before cure |
| Viscosity | 2,200 to 3,200 | cP | At 23 deg C and 100 rpm |
| Particle size | <= 45 | microns | Lot-acceptance property |
After-processing / final-state properties
Typical cured values retain the stated cure, test method, and die-attach context; the two thermal-conductivity values use different bases.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Recommended cure | 1 | h | At 150 deg C |
| Alternative cure | 5 min at 150 deg C; 15 min at 120 deg C; 3 h at 80 deg C | - | Minimum alternative cures may not achieve all listed properties |
| Glass transition temperature | >= 80 | deg C | Dynamic cure: 20 to 200 deg C; ISO 25 min; ramp -10 to 200 deg C at 20 deg C/min |
| Shore D hardness | 75 | - | Typical cured value |
| Lap shear strength | 1,475 | psi | At 23 deg C |
| Die shear strength | >= 10 kg / 3,556 | psi | At 23 deg C |
| Thermal conductivity | 2.5 | W/(m K) | Laser-flash method |
| Calculated thermal conductivity | 29 | W/(m K) | Derived from thermal-resistance data; method basis retained separately |
| Volume resistivity | <= 0.0004 | ohm cm | At 23 deg C |
