EPOTEK H70E
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Thermal Conduction with Electrical Isolation
- 56-Hour Mixed Pot Life
- Rapid One-Minute Snap-Cure Option
Product Description
EPO-TEK H70E Thermally Conductive Epoxy is a two-component, thermally conductive and electrically insulating epoxy for chip bonding, die attach, and heat-sinking applications. The slightly pourable paste mixes 1:1 by weight, has a 56-hour pot life, and can be screen printed, machine dispensed, stamped, or hand applied. stated bondline cure options range from one minute at 175 deg C to 90 minutes at 80 deg C. Typical cured properties include 0.9 W/(m K) thermal conductivity, volume resistivity of at least 1 x 10^13 ohm cm, and Shore D hardness of 83.
Key features
- Thermal conduction with electrical isolation: Typical cured values include 0.9 W/(m K) thermal conductivity and volume resistivity of at least 1 x 10^13 ohm cm.
- Extended room-temperature pot life: The mixed system provides a 56-hour pot life.
- Rapid heat-cure options: The documented minimum bondline cure includes one minute at 175 deg C.
Applications
- Chip bonding in microelectronics and optoelectronics
- Die attach
- Fast circuit repairs
- Heat-sinking adhesive applications
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied values for the two-component thermally conductive, electrically insulating epoxy.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio by weight | 1:1 | - | Part A:Part B |
| Specific gravity | Part A 1.5; Part B 2.5 | - | As supplied |
| Pot life | 56 | h | Mixed system |
| Shelf life | 1 | year | At room temperature |
| Color | Part A grey; Part B light grey | - | Before cure |
| Consistency | Slightly pourable paste | - | Before cure |
| Viscosity | 4,000 to 7,000 | cP | At 23 deg C and 50 rpm |
| Particle size | <= 50 | microns | Lot-acceptance property |
After-processing / final-state properties
Typical cured values retain the stated cure, temperature, and die-attach test context.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Minimum bondline cure | 1 min at 175 deg C; 5 min at 150 deg C; 15 min at 120 deg C; 90 min at 80 deg C | - | Cure schedule |
| Glass transition temperature | >= 80 | deg C | Dynamic cure: 20 to 200 deg C; ISO 25 min; ramp -10 to 200 deg C at 20 deg C/min |
| Operating temperature - continuous | -55 to 200 | deg C | Suggested range |
| Operating temperature - intermittent | -55 to 300 | deg C | Suggested range |
| Shore D hardness | 83 | - | Typical cured value |
| Lap shear strength | > 2,000 | psi | At 23 deg C |
| Die shear strength | >= 10 kg / 3,400 | psi | At 23 deg C |
| Thermal conductivity | 0.9 | W/(m K) | Typical cured value |
| Dielectric constant | 4.22 | - | At 1 kHz |
| Volume resistivity | >= 1 x 10^13 | ohm cm | Typical cured value |
