EPOXYLITE E5302
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Equal-Weight Premeasured Mixing
- Extended Room-Temperature Work Window
- High-Tg Heat-Cure Bonding
Product Description
EPOXYLITE E5302 Hi Temp Epoxy Adhesive and Sealant is a heat-cured, two-component system for bonding and sealing electrical and electronic components exposed to high temperatures. The premeasured kit combines a viscous liquid resin with a powder hardener at a 100:100 mix ratio by weight. Warming the resin before mixing supports lower viscosity and bubble release, while the mixed material provides an 8 to 12 hour pot life at room temperature. stated cure options range from 16 hours at 93 deg C to 30 minutes at 204 deg C. Typical cured data include a 230 deg C glass transition temperature and aluminum lap shear measured at both 25 and 260 deg C.
Key features
- Premeasured equal-weight mix: The resin and powder hardener are supplied for a 100:100 mix ratio by weight.
- Extended processing window: The mixed material provides an 8 to 12 hour pot life at room temperature.
- High-temperature cured properties: Typical data include Tg of 230 deg C and aluminum lap shear of 500 psi at 260 deg C.
Applications
- Bonding electrical and electronic components requiring high-temperature resistance
- Sealing electrical and electronic components requiring high-temperature resistance
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical component and mixed-material values for the premeasured two-component kit.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component form | Viscous liquid resin; powder hardener | - | As supplied |
| Resin viscosity | 20,000 to 40,000 | cP | At 25 deg C |
| Weight per gallon | Resin 11.3 to 11.7; hardener 17.5 to 17.9 | lb/gal | At 25 deg C |
| Flash point | > 94 | deg C | ASTM D93; both components |
| Mix ratio by weight | 100:100 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed material at room temperature |
| Shelf life | 6 | months | Original sealed containers below 25 deg C in a dry controlled environment out of direct sunlight |
After-processing / final-state properties
Typical cured values retain the stated cure, substrate, method, temperature, and specimen context.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; 30 min at 204 deg C | - | Cure options |
| Post-cure | 1 | h | At 204 deg C when the highest possible heat resistance is required |
| Shore D hardness | 90 | - | Typical cured value |
| Glass transition temperature | 230 | deg C | TMA |
| CTE below Tg | 42 | ppm/deg C | TMA |
| Linear shrinkage | 2 | % | ASTM D2566; 100 deg C cure |
| Lap shear strength | 1,800 at 25 deg C; 500 at 260 deg C | psi | Aluminum-to-aluminum; ASTM D1002 |
| Compressive strength | 40,000 | psi | ASTM D695 at 25 deg C |
| Dielectric strength | 560 | volts/mil | ASTM D149 at 25 deg C; 125 mil specimen |
| Volume resistivity | 1 x 10^16 | ohm cm | ASTM D257 at 25 deg C |
