EPOXYLITE E5403
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Premeasured Powder-Hardener Kit
- Brush, Spatula, or Syringe Application
- Low-Shrinkage High-Tg Cure
Product Description
EPOXYLITE E5403 Hi Temp Epoxy Adhesive and Sealant is a heat-cured, two-component epoxy for bonding and sealing electrical and electronic components requiring high-temperature resistance. The premeasured kit contains a paste resin and powder hardener mixed 100:28 by weight. The mixed material provides an 8 to 12 hour pot life at room temperature and can be applied by brush, spatula, or syringe. stated cure options range from 16 hours at 93 deg C to 30 minutes at 204 deg C. Typical cured properties include Shore D 90, a 220 deg C glass transition temperature, and aluminum lap shear values measured at 25 and 260 deg C.
Key features
- Premeasured resin-hardener kit: The paste resin and powder hardener use a 100:28 mix ratio by weight.
- Extended processing window: The mixed material provides an 8 to 12 hour pot life at room temperature.
- High-Tg cured material: Typical cured Tg is 220 deg C by TMA.
Applications
- Bonding electrical and electronic components requiring high-temperature resistance
- Sealing electrical and electronic components requiring high-temperature resistance
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical component and mixed-material values for the premeasured two-component kit.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component form | Paste resin; powder hardener | - | At 25 deg C |
| Weight per gallon | Resin 13.3 to 13.7; hardener 14.7 to 15.1 | lb/gal | At 25 deg C |
| Flash point | > 94 | deg C | ASTM D93; both components |
| Mix ratio by weight | 100:28 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed material at room temperature |
| Shelf life | 6 | months | Original sealed containers below 25 deg C in a dry controlled environment out of direct sunlight |
| Volatile organic content | 0.2 | lb/gal | ASTM D6053; 2 g thin film cured 1 h at 150 deg C |
After-processing / final-state properties
Typical cured values retain the stated cure, substrate, method, temperature, and specimen context.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure schedule | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; 30 min at 204 deg C | - | Cure options |
| Post-cure | 1 | h | At 204 deg C when the highest possible heat resistance is required |
| Shore D hardness | 90 | - | ASTM D2240 at 25 deg C |
| Glass transition temperature | 220 | deg C | ASTM E831; TMA |
| CTE below Tg | 45 | ppm/deg C | ASTM E831 |
| Linear shrinkage | < 1 | % | ASTM D2566; 100 deg C cure |
| Weight loss | < 1 | % | ASTM D3377; 168 h at 180 deg C |
| Lap shear strength | 1,800 at 25 deg C; 400 at 260 deg C | psi | Aluminum-to-aluminum; ASTM D1002 |
| Compressive strength | 40,000 | psi | ASTM D695 at 25 deg C |
| Dielectric strength | 560 | volts/mil | ASTM D149 at 25 deg C; 125 mil specimen |
| Volume resistivity | 1 x 10^16 | ohm cm | ASTM D257 at 25 deg C |
