EPOXYLITE E6203
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Premeasured Powder-Hardener Kit
- Extended Room-Temperature Work Window
- High-Temperature Electrical Potting
Product Description
EPOXYLITE E6203 Hi Temp Epoxy Potting Compound is a two-component heat-cured potting system supplied as a viscous liquid resin and finely divided powder hardener in premeasured kits. It is used for potting and sealing electrical and electronic components that require high-temperature resistance. The components mix at 100:50 by weight, and the mixed material has an 8 to 12 hour pot life at room temperature. Multiple heat-cure options are available, and the cured material reaches Shore D 90 hardness, a glass transition temperature of 220 deg C, and 40,000 psi compressive strength.
Key features
- Premeasured powder-hardener kit: The resin and hardener are supplied in controlled kit quantities for 100:50 mixing by weight.
- Eight-to-twelve-hour pot life: The mixed compound provides an extended room-temperature processing window.
- High-temperature cured properties: The cured system has a reported Tg of 220 deg C and retains measured lap shear at 260 deg C.
Applications
- Potting and sealing electrical and electronic components requiring high-temperature resistance
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
As-supplied / before-processing properties
Typical as-supplied and mixed-system values for the premeasured two-component kit.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component form | Resin liquid; hardener powder | - | At 25 deg C |
| Resin viscosity | 20,000 to 40,000 | cP | At 25 deg C |
| Weight per gallon | Resin 11.3 to 11.7; hardener 15.7 to 16.1 | lb/gal | At 25 deg C |
| Mix ratio by weight | 100:50 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed system at room temperature |
| Recommended resin conditioning | 65 to 85 | deg C | Warm before adding powder hardener |
| Shelf life | 6 | months | Below 25 deg C in original sealed containers |
After-processing / final-state properties
Typical cured properties retain the stated cure and test conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure options | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; or 30 min at 204 deg C | - | Time begins after the unit reaches temperature |
| Optional post-cure | 1 h at 204 deg C | - | For highest possible heat resistance |
| Hardness | 90 | Shore D | ASTM D2240 at 25 deg C |
| Glass transition temperature | 220 | deg C | ASTM E831, TMA |
| Coefficient of thermal expansion | 45 | ppm/deg C | ASTM E831 below Tg |
| Lap shear strength | 2,500 at 25 deg C; 500 at 260 deg C | psi | ASTM D1002, aluminum-to-aluminum |
| Compressive strength | 40,000 | psi | ASTM D695 at 25 deg C |
| Dielectric strength | 560 | V/mil | ASTM D149 at 25 deg C, 125 mil specimen |
| Volume resistivity | > 1 x 10^16 | ohm cm | ASTM D257 at 25 deg C |
