EPOXYLITE E810-1
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Three-Component Placement Control
- Rapid Three-to-Five-Minute Set
- High-Temperature Metal Bonding
Product Description
EPOXYLITE E810-1 Hi Temp Epoxy Adhesive is a three-component heat-cured adhesive with a viscous liquid resin, powder hardener, and liquid accelerator. It is used as a high-temperature sealant and adhesive for metal-to-metal bonds. The resin, hardener, and accelerator mix at 100:125:11 by weight. Before accelerator addition, the resin-hardener blend has an approximately 45 minute working time; the full-accelerator mixture begins to set in 3 to 5 minutes for part placement before heat cure. Typical cured performance includes Shore D 90 hardness and 1,700 psi aluminum-to-aluminum lap shear.
Key features
- Room-temperature placement set: The accelerator initiates a 3 to 5 minute set for positioning before final heat cure.
- Controlled three-component system: Resin, powder hardener, and accelerator mix at 100:125:11 by weight.
- High-temperature metal bonding: The adhesive is intended for metal-to-metal bonds with continuous-service use documented up to 200 deg C.
Applications
- High-temperature sealant and adhesive applications
- Metal-to-metal bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical component and working-time data for the three-component system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin viscosity | 10,000 to 30,000 | cP | Part A at 25 deg C |
| Hardener form | Powder | - | Part B at 25 deg C |
| Accelerator viscosity | 50 to 150 | cP | Part C at 25 deg C |
| Mix ratio by weight | 100:125:11 | - | Resin:hardener:accelerator |
| Working time before accelerator | Approximately 45 | min | Resin and hardener blend |
| Set time with full accelerator | 3 to 5 | min | Mixed system begins to set |
| Hardening time | 30 to 60 | min | After application at room temperature |
| Shelf life | 6 | months | Below 25 deg C in original sealed containers |
After-processing / final-state properties
Typical cured values apply after the stated cure or post-cure conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Room-temperature cure | 24 | h | For non-load-bearing applications |
| Post-cure options | 4 h at 121 deg C or 2 h at 150 deg C | - | Required to develop full properties |
| Hardness | 90 | Shore D | ASTM D2240 at 25 deg C |
| Lap shear strength | 1,700 | psi | ASTM D1002, aluminum-to-aluminum at 25 deg C |
| Tensile strength | 2,300 | psi | ASTM D638 at 25 deg C |
| Compressive strength | 40,000 | psi | ASTM D695 at 25 deg C |
| Dielectric strength | 560 | V/mil | ASTM D149 at 25 deg C, 125 mil specimen |
| Volume resistivity | 4 x 10^15 | ohm cm | ASTM D257 at 25 deg C |
| Continuous service temperature | Up to 200 | deg C | Most applications; service statement |
