EPOXYLITE E8121
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Thin-Bond-Line Adhesive Cementing
- Extended Thin-Bond-Line Work Time
- High-Temperature Lap Shear
Product Description
EPOXYLITE E8121 Hi Temp Epoxy Adhesive is a two-component heat-cured adhesive supplied as a viscous liquid resin and powder hardener in premeasured kits. It is used for cementing applications that require high thermal resistance and a thin bond line, including strain gage attachment. The components mix at 100:50 by weight and provide an 8 to 12 hour pot life at room temperature. The cured material has a Tg of 220 deg C, Shore D 95 hardness, and aluminum-to-aluminum lap shear of 2,500 psi at 25 deg C.
Key features
- Thin-bond-line cementing: The system is intended for high-temperature cementing where a thin adhesive layer is required.
- Strain gage attachment: The adhesive is specifically positioned for attaching strain gages.
- High-temperature cured strength: Typical lap shear is 2,500 psi at 25 deg C and 500 psi at 260 deg C on aluminum.
Applications
- High-temperature thin-bond-line cementing
- Strain gage attachment
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
Viscosity (Part B)Viscosity (Part B)
powder mPa.sThermal Properties
Flash PointFlash Point
94 °CGlass Transition Temperature (Tg)Glass Transition Temperature (Tg)
220 °CElectrical Properties
Dielectric StrengthDielectric Strength
22 kV/mmVolume ResistivityVolume Resistivity
1 x 10^16 Ohms⋅cmAdditional Information
Technical properties
As-supplied / before-processing properties
Typical component, mixing, and storage values before heat cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin viscosity | 30,000 to 50,000 | cP | At 25 deg C |
| Hardener form | Powder | - | At 25 deg C |
| Weight per gallon | Resin 10.4 to 10.8; hardener 14.9 to 15.3 | lb/gal | At 25 deg C |
| Mix ratio by weight | 100:50 | - | Resin:hardener |
| Pot life | 8 to 12 | h | Mixed system at room temperature |
| Recommended resin conditioning | 65 to 85 | deg C | Before adding powder hardener |
| Shelf life | 6 | months | Below 25 deg C in original sealed containers |
Technical properties
After-processing / final-state properties
Typical cured properties preserve the stated methods, substrates, and temperatures.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure options | 16 h at 93 deg C; 4 h at 121 deg C; 1 h at 177 deg C; or 30 min at 204 deg C | - | Time begins after the unit reaches temperature |
| Optional post-cure | 1 h at 204 deg C | - | For highest possible heat resistance |
| Hardness | 95 | Shore D | ASTM D2240 at 25 deg C |
| Glass transition temperature | 220 | deg C | ASTM E831, TMA |
| Coefficient of thermal expansion | 45 | ppm/deg C | ASTM E831 below Tg |
| Lap shear strength | 2,500 at 25 deg C; 500 at 260 deg C | psi | ASTM D1002, aluminum-to-aluminum |
| Tensile strength | 4,000 | psi | ASTM D638 at 25 deg C |
| Compressive strength | 40,000 | psi | ASTM D695 at 25 deg C |
| Dielectric strength | 560 | V/mil | ASTM D149 at 25 deg C, 125 mil specimen |
| Volume resistivity | > 1 x 10^16 | ohm cm | ASTM D257 at 25 deg C |
