EPOXYLITE E8822
Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses
Main features
- Mineral-Filled Thermal Formulation
- Sixteen-Hour Mixed Pot Life
- Elevated-Temperature Bond Retention
Product Description
EPOXYLITE E8822 Hi Temp Epoxy Adhesive is a two-component heat-cured adhesive supplied as a mineral-filled paste resin and thixotropic liquid hardener in premeasured kits. It is used for cementing applications that require high thermal resistance, with bonding use stated for metals, ceramics, and plastics. The components mix at 100:35 by weight, and the mixed adhesive has a typical viscosity of 200,000 to 300,000 cP and about 16 hours of pot life at room temperature. The mineral-filled formulation combines thermal conductivity with electrical insulation properties.
Key features
- Mineral-filled thermal formulation: The paste resin is mineral-filled for enhanced thermal conductivity.
- Sixteen-hour pot life: The mixed adhesive provides about 16 hours of processing time at room temperature.
- High-temperature bond retention: Typical aluminum lap shear remains above 500 psi at 260 deg C.
Applications
- High-temperature cementing applications
- Bonding metals, ceramics, and plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical component, mixed-material, processing, and storage values.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Component form | Mineral-filled paste resin; thixotropic liquid hardener | - | As supplied |
| Resin viscosity | 400,000 to 800,000 | cP | At 25 deg C |
| Hardener viscosity | 150,000 to 250,000 | cP | At 25 deg C |
| Weight per gallon | Resin 13.6 to 14.0; hardener 12.1 to 12.5 | lb/gal | At 25 deg C |
| Mix ratio by weight | 100:35 | - | Resin:hardener |
| Mixed viscosity | 200,000 to 300,000 | cP | At 25 deg C |
| Sunshine gel time | 5 to 10 | min | At 125 deg C |
| Pot life | About 16 | h | Mixed system at room temperature |
| Shelf life | 3 | months | Below 25 deg C in original sealed containers |
After-processing / final-state properties
Typical cured electrical and mechanical properties apply to specimens cured 4 hours at 177 deg C unless otherwise stated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Cure options | 16 h at 60 deg C; 2 h at 150 deg C; or 1 h at 177 deg C | - | Time begins after the unit reaches temperature |
| High-resistance cure | 4 h at 177 deg C | - | For highest possible heat and chemical resistance |
| Dielectric strength | 460 | V/mil | ASTM D149 at 25 deg C, 50 mil specimen |
| Dielectric strength after water exposure | 370 | V/mil | ASTM D149 after 24 h in water, 50 mil specimen |
| Volume resistivity | 5.7 x 10^16 | ohm cm | ASTM D257 at 25 deg C |
| Hardness | 95 | Shore D | ASTM D2240 at 25 deg C |
| Glass transition temperature | 140 | deg C | ASTM E831, TMA |
| Lap shear strength | > 1,500 at 25 deg C; > 500 at 260 deg C | psi | ASTM D1002, aluminum-to-aluminum |
